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| (R) STTH2R06 HIGH EFFICIENCY ULTRAFAST DIODE Table 1: Main Product Characteristics IF(AV) VRRM Tj VF (typ) trr (typ) FEATURES AND BENEFITS 2A 600 V 175C 1V 35 ns DO-41 STTH2R06 A K Very low conduction losses Negligible switching losses Low forward and reverse recovery times High junction temperature SMA STTH2R06A DESCRIPTION The STTH2R06 is using ST Turbo 2 600V planar Pt doping technology. It is specially suited for switching mode base drive & transistor circuits. Packaged in axial, SMA, SMB and SMC, this device is intended for use in high frequency inverters, free wheeling and polarity protection. SMB STTH2R06U Table 2: Order Codes Part Number STTH2R06 STTH2R06RL STTH2R06A STTH2R06U STTH2R06S Marking STTH2R06 STTH2R06 R6A R6U R62 SMC STTH2R06S Table 3: Absolute Ratings (limiting values) Symbol VRRM IF(RMS) RMS forward voltage DO-41 IF(AV) Average forward current = 0.5 SMA SMB SMC IFSM Tstg Tj June 2005 Parameter Repetitive peak reverse voltage TL = 70C TL = 85C TL = 100C TL = 115C tp = 10ms sinusoidal Value 600 7 Unit V A 2 A Surge non repetitive forward current Storage temperature range Operating junction temperature range DO-41 SMA / SMB / SMC 40 30 -65 to + 175 -40 to + 175 A C C 1/9 REV. 2 STTH2R06 Table 4: Thermal Resistance Symbol Parameter DO-41 Rth(j-l) Junction to lead SMA SMB SMC L = 5 mm Value (max). 35 30 25 20 C/W Unit Table 5: Static Electrical Characteristics Symbol IR * Parameter Reverse leakage current Test conditions Tj = 25C Tj = 150C Tj = 25C Tj = 150C VR = VRRM Min. Typ Max. 2 A 12 85 1.7 V 1.0 1.25 Unit VF ** Pulse test: Forward voltage drop * tp = 5 ms, < 2% ** tp = 380 s, < 2% IF = 2A To evaluate the conduction losses use the following equation: P = 1 x IF(AV) + 0.125 IF (RMS) 2 Table 6: Dynamic Characteristics Symbol trr tfr VFP Parameter Reverse recovery time Forward recovery time Forward recovery voltage Tj = 25C Test conditions IF = 0.5A Irr = 0.25A IR =1A IF = 1A dIF/dt = -50 A/s VR =30V IF = 2A dIF/dt = 100 A/s VFR = 1.1 x VFmax 35 Min. Typ Max. Unit 30 ns 50 100 10 ns V Tj = 25C 2/9 STTH2R06 Figure 1: Conduction losses versus average forward current P(W) 3.0 Figure 2: Forward voltage drop versus forward current IFM(A) 10 9 8 Tj=150C (maximum values) = 0.05 2.5 = 0.1 = 0.2 = 0.5 2.0 =1 7 6 Tj=150C (typical values) 1.5 5 4 1.0 T 0.5 3 2 Tj=25C (maximum values) IF(AV)(A) 0.0 0.0 0.5 1.0 1.5 =tp/T 2.0 tp 2.5 1 0 0.00 0.25 0.50 0.75 1.00 1.25 1.50 VFM(V) 1.75 2.00 2.25 2.50 2.75 3.00 Figure 3: Relative variation of thermal impedance junction to case versus pulse duration (SMA/SMB/SMC: SCU = 1cm2) Zth(j-a)/Rth(j-a) 1.0 0.9 0.8 SMA Figure 4: Peak reverse recovery current versus dIF/dt (typical values) IRM(A) 9 8 7 6 5 IF=0.5 x IF(AV) IF=IF(AV) VR=400V Tj=125C IF=2 x IF(AV) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Single pulse SMC DO-41 4 3 SMB 2 tp(s) 1 0 0 50 100 150 dIF/dt(A/s) 200 250 300 350 400 450 500 Figure 5: Reverse recovery time versus dIF/dt (typical values) trr(ns) 300 VR=400V Tj=125C Figure 6: Reverse recovery charges versus dIF/dt (typical values) Qrr(nC) 400 350 300 VR=400V Tj=125C 250 IF=2 x IF(AV) 200 250 IF=2 x IF(AV) IF=IF(AV) IF=IF(AV) 150 200 IF=0.5 x IF(AV) IF=0.5 x IF(AV) 150 100 100 50 50 dIF/dt(A/s) 0 0 50 100 150 200 250 300 350 400 450 500 0 0 100 dIF/dt(A/s) 200 300 400 500 3/9 STTH2R06 Figure 7: Relative variations of dynamic parameters versus junction temperature 1.2 Figure 8: Transient peak forward voltage versus dIF/dt (typical values) VFP(V) 30 IF=IF(AV) Tj=125C 1.0 25 0.8 trr IRM 20 0.6 QRR IF=IF(AV) VR=400V Reference: Tj=125C 15 0.4 10 0.2 Tj(C) 0.0 25 50 75 100 125 5 dIF/dt(A/s) 0 0 50 100 150 200 250 Figure 9: Forward recovery time versus dIF/dt (typical values) tfr(ns) 300 IF=IF(AV) VFR=1.1 x VF max. Tj=125C Figure 10: Junction capacitance versus reverse voltage applied (typical values) C(pF) 100 F=1MHz VOSC=30mVRMS Tj=25C 250 200 150 10 100 50 dIF/dt(A/s) 0 0 50 100 150 200 250 1 1 10 VR(V) 100 1000 Figure 11: Thermal resistance junction to ambient versus copper surface under each lead (epoxy FR4, eCU=35m) (SMA/SMB/SMC) Rth(j-a)(C/W) 120 Figure 12: Thermal resistance versus lead length (DO-41) Rth(C/W) 120 Rth(j-a) 100 SMA SMB 100 80 80 60 SMB 60 Rth(j-l) 40 40 20 20 SCU(cm) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 5 10 Llead(mm) 15 20 25 4/9 STTH2R06 Figure 13: SMA Package Mechanical Data DIMENSIONS E1 REF. Millimeters Min. Max. 2.03 0.20 1.65 0.41 5.60 4.60 2.95 1.60 Inches Min. 0.075 0.002 0.049 0.006 0.189 0.156 0.089 0.030 Max. 0.080 0.008 0.065 0.016 0.220 0.181 0.116 0.063 D A1 A2 b 1.90 0.05 1.25 0.15 4.80 3.95 2.25 0.75 E c A1 E E1 b C L A2 D L Figure 14: SMA Foot Print Dimensions (in millimeters) 2.30 1.50 2.30 1.75 6.10 5/9 STTH2R06 Figure 15: SMB Package Mechanical Data DIMENSIONS E1 REF. Millimeters Min. Max. 2.45 0.20 2.20 0.41 5.60 4.60 3.95 1.60 Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.063 D A1 A2 b 1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75 E c A1 E E1 b C L A2 D L Figure 16: SMB Foot Print Dimensions (in millimeters) 2.23 1.64 2.23 2.30 6.10 6/9 STTH2R06 Figure 17: SMC Package Mechanical Data DIMENSIONS E1 REF. Millimeters Min. Max. 2.45 0.20 3.2 0.41 8.15 7.15 4.70 6.25 1.60 Inches Min. 0.075 0.002 0.114 0.006 0.305 0.260 0.173 0.218 0.030 Max. 0.096 0.008 0.126 0.016 0.321 0.281 0.185 0.246 0.063 A1 D 1.90 0.05 2.90 0.15 7.75 6.60 4.40 5.55 0.75 A2 b E c E A1 E1 b C E2 L A2 E2 D L Figure 18: SMC Foot Print Dimensions (in millimeters) 2.20 4.25 2.20 3.30 8.65 7/9 STTH2R06 Figure 19: DO-41 Package Mechanical Data DIMENSIONS C A C OB / REF. Millimeters Min. Max. 5.20 2.71 Inches Min. 0.160 0.080 1.102 Max. 0.205 0.107 A B OD / OD / 4.07 2.04 28 0.712 C D 0.863 0.028 0.034 Table 7: Ordering Information Part Number STTH2R06 STTH2R06RL STTH2R06A STTH2R06U STTH2R06S Marking STTH2R06 STTH2R06 R6A R6U R62 Package DO-41 DO-41 SMA SMB SMC Weight 0.34 g 0.34 g 0.068 g 0.11 g 0.243 g Base qty 2000 5000 5000 2500 2500 Delivery mode Ammopack Tape & reel Tape & reel Tape & reel Tape & reel Table 8: Revision History Date 07-Sep-2004 1-Jun-2005 Revision 1 2 First issue. SMC package addition. Description of Changes 8/9 STTH2R06 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 9/9 |
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